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先进封装载板FC与FO到PCB的细线化市场研究和策略咨询公司Yole报告认为,当前先进的IC封装有倒芯片(FC)封装和扇出重布线(FO RDL)封装。当今先进的封装载板为符合2.5D/3D TSV的FC封装和薄膜RDLs(FO WLP)封装要求,载板线路的L/S 15/15微米分辨率,并向L/S<10/10微米过渡。这些高端集成电路(CPU/GPU,DSP等)应用于最新技术的计算、网络、移动驱动,高端消
Yole, a thin-gauge market research and strategy consultancy with advanced carrier-board FCs and FO-to-PCB, states that the current state-of-the-art IC packages are available in flip-chip (FC) packages and fan-out rewiring (FO RDL) packages. Today’s advanced carrier boards are L / S 15/15 micron resolution for carrier line compliance in 2.5G / 3D TSV-compliant FC package and thin film RDLs (FO WLP) package packages, with L / S <10/10 micron transition. These high-end integrated circuits (CPUs / GPUs, DSPs, etc.) are used in the latest generation of computing, networking, mobile drives, high end consumer