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通过DSC分析研究了不同软化点的双环戊二烯(DCPD)酚型环氧与DCPD苯酚树脂在溴化阻燃树脂体系中的固化反应特性并测试了其FR-4覆铜板的性能。结果表明:体系固化反应温度范围较大,DCPD酚型环氧软化点为50,80、90℃时,树脂体系反应活化能分别为98.3,82.3与74.2 kJ/mol。其制成板材的Tg在150℃以上,介电性能良好。随着DCPD酚型环氧树脂软化点的提高,板材玻璃化温度明显提高,高温高压下其吸水率降低,而热分解温度、粘接性及介电性能无明显变化。
The curing reaction characteristics of DCPD phenolic epoxy resin and DCPD phenol resin with different softening points in brominated flame retardant resin system were studied by DSC. The properties of FR-4 copper clad laminate were tested. The results showed that the curing reaction temperature range of the system was large, and the reaction activation energies of the resin system were 98.3, 82.3 and 74.2 kJ / mol, respectively, when the DCPD phenol type epoxy softening point was 50, 80 and 90 ℃. The sheet made of its Tg above 150 ℃, good dielectric properties. With the increase of the softening point of DCPD phenolic epoxy resin, the glass transition temperature of the plate increased obviously, while the water absorption of the plate decreased, while the thermal decomposition temperature, adhesiveness and dielectric properties did not change significantly.