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本文主要研究了微米/纳米尺度的键合技术和键合强度,给出并发展了基于MEMS技术的微米/纳米键合分析模型.为提取微米/纳米键合面积的最大剪应力和压应力,设计、制备和测试了一系列单晶硅悬臂梁结构.并使用理论公式和ANSYS有限元模拟对实验结果进行了分析.键合强度可以分为扭转和剪压表征两部分.根据测试值可得,最大抗扭强度为1.9×109μN.μm,最大压应力为68.3 MPa.
In this paper, we mainly studied the bonding technology at micrometer / nanoscale and the bonding strength, and gave and developed the micrometer / nanometer bonding analysis model based on MEMS technology.In order to extract the maximum shear stress and compressive stress of micrometer / nanometer bonding area, A series of monocrystalline silicon cantilever structures were designed, fabricated and tested. The experimental results were analyzed by theoretical formula and ANSYS finite element simulation. The bond strength can be divided into two parts: torsion and shear stress characterization , The maximum torsional strength of 1.9 × 109μN.μm, the maximum compressive stress of 68.3 MPa.