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真空电子器件密封的关键技术就是金属-陶瓷封接。为了提高氧化铝陶瓷的封接性能,通过活化钼-锰法将钨基密封材料涂覆到氧化铝陶瓷表面进行一次金属化,然后采用化学镀Ni-P方法进行二次金属化。针对钨基一次金属化材料表面比较难活化的特点,提出了一种打磨与酸洗相结合的新型预处理方法。实验结果表明,采用打磨后再酸洗的预处理方法所得到的化学镀Ni-P层表面光滑致密,Ni-P镀层与一次金属化基体的结合力良好。
The key technology for sealing vacuum electronics is metal-to-ceramic sealing. In order to improve the sealing performance of alumina ceramics, a tungsten-based sealing material is coated on the surface of the alumina ceramic by activation molybdenum-manganese method to carry out primary metallization and then secondary metallization by the electroless Ni-P plating method. Aiming at the characteristics that the surface of tungsten-based primary metal material is more difficult to be activated, a new pretreatment method combined with grinding and pickling is proposed. The experimental results show that the surface of electroless Ni-P electroless Ni-P layer obtained by the pretreatment method of sanding after pickling is smooth and dense, and the bonding strength between Ni-P coating and the first metalized substrate is good.