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全集成3G射频芯片10月25日，在Philips半导体举办的“亚洲移动通信媒体论坛”上，该公司推出了业内首个全集成3G射频解决方案，可降低3G功能的成本，加快手机的开发。先进的3G射频芯片组还极大提高了手机的接收、发送及功率放大能力。Philips半导体移动通信业务执行副总裁Thier
Fully integrated 3G RF chip October 25, at the Philips Semiconductors Asia Mobile Media Forum, the company introduced the industry’s first fully integrated 3G radio frequency solution to reduce the cost of 3G capabilities and accelerate the development of mobile phones. Advanced 3G RF chipset also greatly improves the mobile phone receiving, sending and power amplification capabilities. Thier, executive vice president, Philips Semiconductors mobile communications business