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现在对芯片制造商而言,向300毫米硅片技术转移面临的最大挑战是能否找到足够的客户或产品,使其生产线保持较高的利用率。技术障碍已经不再是关键问题。 采用300毫米硅片生产芯片已经从实验室和实验生产线走向商业化规
Now for chip makers, the biggest challenge in moving to the 300-mm silicon technology is finding enough customers or products to keep their production lines up-to-date. Technical barriers are no longer the key issue. 300mm silicon chip production has been from the laboratory and experimental production line to commercial regulation