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中国电子学会生产技术学会焊接学组首次“微电子焊接技术讨论会”于1982年10月8日至12日在石家庄市召开,参加讨论会的有来自全国各地37个单位的54名代表,电子工业部河北半导体研究所付总工程师常振华同志主持了这次讨论会。会议共收到论文41篇,其中有38篇在大会做了发言,接着会议分芯片焊接、引线焊接和封装焊接三个专题进行了深入地讨论。通过大会发言与分组讨论,各单位充分交流了经验,并对一些学术性的问题进行了讨论和探讨。这次讨论会,基本上反映了我国目前微电子器件焊接技术的水平和现状,并对今后的发展交换了看法,提出了一些有益的意见和建议。会议认为,当前我国在微电子器件焊接方面存在的问题较多,严重地阻碍着电子器件质量的进一步提高,是影响我国电子产品可靠性的关键因素之一,应该受到足够的重视。过去各单位在这方面都做了许多工作,取得了不少经验,但是不少单位还存在着重设计轻工
China Institute of Electronics Society of welding technology group for the first time “Microelectronics Welding Technology Symposium” in October 8, 1982 to 12 in Shijiazhuang City held a total of 54 representatives from 37 units across the country, attended the seminar, electronics Ministry of Industry, Hebei Institute of semiconductor chief engineer Chang Zhenhua paid to preside over the seminar. The conference received a total of 41 papers, of which 38 made a speech in the General Assembly, then the conference sub-chip welding, lead soldering and package welding three topics in-depth discussion. Through the speeches and group discussions of the General Assembly, all units exchanged their experiences fully and discussed and discussed some academic issues. This symposium basically reflected the current level and current status of welding technology for microelectronic devices in our country, exchanged views on future developments and put forward some useful suggestions and suggestions. The meeting held that at present, China has more problems in the welding of microelectronic devices, which seriously hinders the further improvement of the quality of electronic devices. It is one of the key factors that affect the reliability of electronic products in our country and should be given enough attention. In the past, all units have done a lot of work in this regard and have gained a lot of experience. However, quite a few units still place emphasis on the design of light industry