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皇家飞利浦电子公司推出一整套100%无铅封装的塑料表面安装小信号分立器件(SMD)产品。在这些产品中,锡铅镀工艺将被纯锡塑工艺(100%sn)取代,以迎合开发有利于环境保护的产品的市场趋势。随着飞利浦在塑料SMD中小信号分立器件向无铅化
Royal Philips Electronics introduced a complete 100% lead-free plastic surface-mount small-signal discrete device (SMD) product. Among these products, the tin-lead plating process will be replaced by the pure tin-plastic process (100% sn) to cater to the market trend of developing products that are environmentally friendly. With Philips small and medium-sized plastic SMD signal to the lead-free discrete devices