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采用料浆包渗法,以SiO2粉为Si源,纯Al粉为还原剂,NaF和NH4Cl作为复合活化剂,Al2O3为惰性添加剂,蛋白质(鸡蛋清)为粘结剂,在Cu表面预先镀Ni层随后900℃、12 h表面渗Si,制备渗Si层。分别研究了CeO2和Al粉含量对渗Si层组织和摩擦性能的影响。结果表明:当铝粉含量20%时,CeO2含量由3%增加到6%,渗层组织为Ni2Si+NiSi相;当CeO2含量6%时,铝粉含量由20%增加到30%,渗层组织变化过程:Ni2Si+NiSi→NiAl→Ni2Al3相,包渗过程由渗硅向渗铝转变;两种渗层的最小摩擦系数都约为纯铜的1/5。
Slurry bag infiltration method was used, SiO2 powder as Si source, pure Al powder as reducing agent, NaF and NH4Cl as complex activator, Al2O3 as inert additive, protein (egg white) as binder, pre-plating Ni on Cu surface The layer was then infiltrated with Si for 12 h at 900 ° C to prepare an infiltrated Si layer. The effects of CeO2 and Al contents on the microstructure and tribological properties of Si infiltrated layers were investigated. The results show that when the content of aluminum powder is 20%, the content of CeO2 increases from 3% to 6%, and the microstructure of the layer becomes Ni2Si + NiSi phase. When the content of CeO2 is 6%, the content of aluminum powder increases from 20% to 30% The microstructure change process: Ni2Si + NiSi → NiAl → Ni2Al3 phase, the infiltration process changes from infiltrating to infiltrating; the minimum coefficient of friction of the two infiltrated layers is about 1/5 of pure copper.