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采用射频反应磁控溅射法在AZ31镁合金表面沉积了TiAlN薄膜。用场发射扫描电镜、电化学工作站研究分析了薄膜的表面形貌以及电化学性能,研究了铝靶溅射功率、钛靶溅射功率、氮气流量、沉积时间对TiAlN薄膜耐腐蚀性能的影响。结果表明实验所制备的TiAlN薄膜表面光滑、致密。当Al靶功率为50 W,Ti靶功率为125 W,N2流量为30 mL/min(标准状态),沉积时间为8 h时薄膜耐腐蚀性能最佳。薄膜腐蚀电流密度(4.321×10-7 A/cm2)比镁合金基体(1.066×10-5 A/cm2)降低了1个数量级以上,镁合金耐腐蚀性能得到较大提高。
TiAlN films were deposited on the surface of AZ31 magnesium alloy by RF reactive magnetron sputtering. The field emission scanning electron microscope and electrochemical workstation were used to analyze the surface morphology and electrochemical performance of the films. The effects of sputtering power of aluminum target, sputtering power of titanium target, nitrogen flow rate and deposition time on the corrosion resistance of TiAlN thin films were studied. The results show that the prepared TiAlN film has a smooth and dense surface. When the Al target power is 50 W, the Ti target power is 125 W and the N2 flow rate is 30 mL / min (standard condition), the corrosion resistance of the film is best when the deposition time is 8 h. The corrosion current density of the film (4.321 × 10-7 A / cm2) is more than one order of magnitude lower than that of the magnesium alloy substrate (1.066 × 10-5 A / cm2), and the corrosion resistance of the magnesium alloy is greatly improved.