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Tungsten (W) thin films were prepared by magnetron sputtering onto Si (100) substrates. Their microstructures were characterized by X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM) and transmission electron microscopy (TEM). The hardness and modulus were evaluated by nanoindentation. It is found that a 30 nm Cr sticking layer induces structure changes of deposited W film from β-W to α-W structure. In addition, remarkable hardness enhancement both for the deposited and annealed W films, were compared with that of bulk coarse-grained W, although their nanoindentation modulus is very close to that of corresponding bulk W. The intrinsic reasons that lead to structure changes and super hardness are discussed.
Tungsten (W) thin films were prepared by magnetron sputtering onto Si (100) substrates. Their microstructures were characterized by X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM) and transmission electron microscopy (TEM) hardness and modulus were evaluated by nanoindentation. It is found that a 30 nm Cr sticking layer induces structure changes of deposited W film from β-W to α-W structure. were compared with that of bulk coarse-grained W, although their nanoindentation modulus is very close to that of corresponding bulk W. The intrinsic reasons that lead to structure changes and super hardness are discussed.