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为了降低微电子机械系统(MEMS)加速度器件的热机械噪声,提高信噪比,使之能应用于石油勘探和地震监测中,对一种三明治式电容加速度传感器的器件级真空封装工艺进行了研究。这种器件级真空封装方法采用可编程高真空封装设备和MEMS工业中常用的材料、工艺,可适用于不同尺寸或布局的MEMS芯片。利用该封装方法,对一种采用自停止腐蚀工艺在中间质量块键合层上制作出2个对称“V”型槽的三明治式电容加速度计进行了真空封装,并对封装后的器件进行性能测试。结果表明,该加速度计在有吸气剂的情况下,品质因子(Q)可达到76,理论热机械噪声为0.026μg/槡Hz,腔体内部压强小于13 Pa,He气细漏检测漏率低于3×10-10Pa.m3/s,氟油粗漏无气泡,满足地震监测要求。
In order to reduce the thermo-mechanical noise of MEMS accelerometers and improve the signal-to-noise ratio, it can be used in oil prospecting and seismic monitoring. The device-level vacuum encapsulation process of a sandwich capacitive accelerometer has been studied . This device-level vacuum packaging method using programmable high-vacuum packaging equipment and MEMS industry commonly used materials, processes, applicable to different sizes or layout of the MEMS chip. Using this packaging method, a sandwich capacitor accelerometer with two symmetrical “V ” grooves on the intermediate mass bonding layer by self-stopping etching was vacuum packaged and the packaged devices Conduct performance testing. The results show that the quality factor (Q) can reach 76, the theoretical thermo-mechanical noise is 0.026μg / 槡 Hz and the internal pressure of the cavity is less than 13 Pa in the presence of getter, Less than 3 × 10-10Pa.m3 / s, no leakage of fluorine oil leakage, to meet the seismic monitoring requirements.