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采用透射电子显微分析（ＴＥＭ）和高分辨透射电子显微分析（ＨＲＥＭ）技术研究了低合金 Ｃｒ－Ｍｏ－Ｖ钢不同回火温度下ＶＣ沉淀相质点的精细结构及其与基体的界面关系．结果表明：较低温度回火时，ＶＣ沉淀相系以｛１００｝ａ为惯习面的纳米尺度的薄片，与基体存在 Ｂａｋｅｒ－Ｎｕｔｔｉｎｇ关系随着回火温度升高，片状相聚集成碳化物团或者发生球化，与基体丧失共格或部分共格。
The fine structure of VC precipitates at different tempering temperatures and their interfacial relations with matrix were investigated by transmission electron microscopy (TEM) and high-resolution transmission electron microscopy (HREM) . The results show that when the tempering temperature is lower, the VC precipitated phase is {100} a, and the Baker-Nutting relationship with the substrate exists as the habit of nanoscale flakes. As the tempering temperature increases, the lamellar phase aggregates into carbides Mission or the occurrence of nodularity, and the matrix lost or partially coherent.