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集成电路封装技术变得越来越复杂,其制造的故障分析(FA)十分复杂。介绍了用时域反射仪对先进封装中的故障隔离技术,这种尝试是通过比较法进行研究的。通过在球栅阵列倒装-芯片(fcBGA)和低外形细节距球栅阵列堆叠芯片(stacked-dieLFBGA)封装中采用时域反射仪并在分析中卓越的实施证明了这种方法是可行的,其中包括信号质量改善以及范围选择。并使用软件模拟来观测在各种故障模式下的时域反射仪信号,以便以不同的故障模式研究时域反射仪性能。得到的观测结果有助于在封装中用时域反射仪进行故障分析隔离。
Integrated circuit packaging technology has become more complex, and its manufacturing fault analysis (FA) is very complicated. This paper introduces the fault isolation technology of advanced package by using time domain reflectometer. This kind of attempt is studied by comparison method. This approach is demonstrated by the time-domain reflectometer used in ball grid array flip-chip (fcBGA) and low-profile stacked-die LFBGA packages and their superior performance in analysis, These include improved signal quality and range selection. And use software simulation to observe the time domain reflectometer signals in various failure modes to study the performance of the time domain reflectometer in different failure modes. The resulting observations help isolate the fault in the package using a time-domain reflectometer.