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硅溶片工艺用于制造MEMS惯性传感器[1]。能够实现高深宽比、导电性好的微机械结构。我所采用这种工艺制造出多种MEMS器件,包括加速度计和陀螺等。但该工艺用于制造垂直动作结构如Z轴加速度计和开关时,成品率不高。主要失效原因是由于EPW腐蚀工艺、去离子水漂洗和释放工艺中出现“液体桥”而引起的粘连。本文提出一种新型硅溶片工艺来防止上述失效。结果证明可以提高成品率和一致性。
Silicon wafer process for the manufacture of MEMS inertial sensors [1]. Can achieve high aspect ratio, good electrical conductivity of the micro-mechanical structure. I use this process to create a variety of MEMS devices, including accelerometers and gyroscopes. However, when the process is used to make vertical motion structures such as Z-axis accelerometers and switches, the yield is not high. The main cause of failure is due to the “liquid bridge” caused by the EPW etching process, deionized water rinsing and releasing process. This paper presents a new silicon dissolution process to prevent the above failure. The results prove that yield and consistency can be improved.