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研究了Cu-Pb过偏晶合金的急冷快速凝固组织特征,定量表征了快速凝固Cu-Pb过偏晶合金的电阻率和力学性能,理论分析了冷却速率和组织形态对合金性能的影响规律.研究结果表明,在急冷快速凝固条件下,Cu-Pb过偏晶合金中的(Cu)相和(Pb)相均以枝晶方式生长,晶体形态以均匀细小的等轴晶为特征.随着冷却速率增大,一方面,凝固组织显著细化,晶界增多,对自由电子的散射作用增强,合金电阻率显著增大;另一方面,细晶强化作用增强,合金的抗拉强度呈线性升高,同时,伴随着晶体缺陷数量的增多,合金的伸长率降低.
The rapid solidification microstructure of Cu-Pb orthorhombic alloy was investigated. The resistivity and mechanical properties of rapidly solidified Cu-Pb over-crystallized alloy were quantitatively characterized. The influence of cooling rate and microstructure on the properties of the alloy was theoretically analyzed. The results show that the (Cu) phase and the (Pb) phase in Cu-Pb orthorhombic alloy grow dendrites under the condition of rapid cooling and rapid solidification, and the crystal morphology is characterized by uniform and fine equiaxed grains. The cooling rate increases. On the one hand, the solidified microstructure is remarkably refined, the grain boundary increases, the scattering effect of free electrons increases, and the resistivity of the alloy increases significantly. On the other hand, the fine grain strengthening effect is enhanced and the tensile strength of the alloy is linear Increase, at the same time, with the increase in the number of crystal defects, alloy elongation decreased.