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自九十年代初期就已显现激光技术在下一代刚挠性印制板加工中会起越来越广泛作用。近几年,只因激光设备的昂贵,专家们考虑为没有、不能或不准备为激光成孔技术投入资金的工厂提供资源。本文分别介绍了大小厂选择外发加工的理由,对YAG和CO_2激光成孔作了比较,与供应商协作的技术问题及注意事
Laser technology has emerged since the early nineties and will play a more and more widespread role in the next generation of flex-rigid printed circuit boards. In recent years, because of the high cost of laser equipment, experts have considered providing resources for factories that do not, can not, or are not prepared to invest in laser forming technology. This paper introduces the reason why the size of the factory to choose the outgoing processing, YAG and CO_2 laser hole were compared with the supplier of technical problems and precautions