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化学镀有置换法和还原法,由于置换法得到镀层薄而附着力和强度等机械性能差,很少应用。还原法虽然沉积速度远低于电镀,但有足够时间,镀层可达600微米以上,而且镀层又具有特殊的性质,所以在许多工业领域中得到广泛应用。本文对化学镀机理,以及化学镀镍及其合金、化学镀铜、化学镀钴及其合金、化学镀金,钯等工艺方法,沉积速度和镀层影响因素作了较详细的介绍,在生产中有一定参考价值。
Electroless plating replacement method and the reduction method, due to replacement of thin coating obtained by adhesion and mechanical properties such as poor strength, rarely used. Although the reduction method deposition rate is much lower than the electroplating, but enough time, the coating up to 600 microns, and the coating has a special nature, it has been widely used in many industrial fields. In this paper, the mechanism of electroless plating, as well as the chemical nickel plating and its alloys, electroless copper plating, electroless cobalt plating and its alloys, electroless gold plating, palladium and other process methods, deposition rate and coating influencing factors were introduced in detail, Certain reference value.