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在gleeble1500力学试验机上,对Sn-4.5Zn-2Bi-In-P,Sn-9Zn-2.5Bi-In-P,Sn-8Zn-3Bi 3种无铅焊料进行系列恒温恒应变速率的压缩试验,实验系列由3种实验温度(20,60,100℃)和5种应变速率(101,100,10-1,10-2,10-3)正交组成。结果表明:3种无铅焊料的饱和应力随应变速率的增加而增加,随温度的升高而减小;在所有实验系列中,Sn-8Zn-3Bi合金的饱和应力最大,Sn-4.5Zn-2Bi-In-P最小;应用非线性拟合方法分别确定了描述3种无铅焊料非弹性率相关性的Anand粘塑性本构方程的9个材料常数;通过实验数据与Anand模型预测数据的对比分析,表明Anand模型能有效描述3种新型无铅焊料的粘塑性行为,为3种无铅焊料焊点的可靠性模拟和失效分析提供模型支持。
In gleeble1500 mechanical testing machine, a series of three kinds of lead-free solder Sn-4.5Zn-2Bi-In-P, Sn-9Zn-2.5Bi-In-P, Sn-8Zn-3Bi compression test at constant temperature and constant strain rate, the experiment Series consists of three kinds of experimental temperature (20,60,100 ℃) and five kinds of strain rate (101,100,10-1,10-2,10-3) orthogonal composition. The results show that the saturation stress of Sn-8Zn-3Bi alloy increases with the increase of strain rate and decreases with the increase of temperature. In all the experimental series, the saturation stress of Sn-8Zn-3Bi alloy is the highest, 2Bi-In-P is the smallest. Nine material constants of Anand visco-plastic constitutive equation describing the inelasticity of three lead-free solders are respectively determined by non-linear fitting method. By comparing the experimental data with the Anand model predictive data The analysis shows that the Anand model can effectively describe the viscoplastic behavior of three new types of lead-free solder and provide model support for the reliability simulation and failure analysis of the three kinds of lead-free solder joints.