Recent advances on thermal analysis of stretchable electronics

• 作 者: Yuhang Li Yuyan Gao Jizhou Son
• 机 构: InstituteofSolidMechanics,DepartmentofEngineeringMechanics,SoftMatterResearchCenter
• 出 处: 力学快报：英文版
• 发表日期: 2016年1期
• 关键词: 电子技术 可拉伸 热分析 机械物理性能 应用程序 半导体材料 有限元模拟 脆性性质 Stretchable electronics Thermal analys
• 基金项目: This work was supported Science Foundation of China by the Zhejiang Provincial Natural （Grant No. LR15A020001）, the National Natural Science Foundation of China （Grant Nos. 11502009, 11372272 and 1132

Stretchable electronics, which offers the performance of conventional wafer-based devices and mechanical properties of a rubber band, enables many novel applications that are not possible through conventional electronics due to its brittle nature. One eff