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编者按作为信息工业的支撑产业——半导体技术正面临一个重大的瓶颈与挑战——热墙(thermal wall)。也就是说,高速化和高密度的微/纳电子器件在很小的空间,产生巨大的热量。这些热量积聚在极小的范围内,使得电子器件的温度急剧升高。在这种情况下,电子器件运行的可靠性和速度降低,并最终导致集成电路被烧毁。因此,如何将产生的热量及时耗散出去,或是如何将这些废热转换成有用的电,是半导体电子工业发展所面临的一个重要课题。这其中包括了很多与物理
Editor’s note As a supporting industry for the information industry - Semiconductor technology is facing a major bottleneck and challenge - the thermal wall. In other words, high-speed and high-density micro / nano electronic devices in a small space, generating huge amounts of heat. These heat accumulate in a very small range, making the temperature of electronic devices increased dramatically. In this case, the reliability and speed of operation of the electronic device is reduced, and finally the integrated circuit is burnt out. Therefore, how to dissipate the generated heat in time or how to convert these waste heat into useful electricity is an important issue for the development of semiconductor electronics industry. This includes a lot with physics