论文部分内容阅读
Thin p + layers with good electrical properties were fabricated by RTA (rapid thermal annealing) with post FA (furance annealing) of Si +/B + dual implanted silicon wafers. The electrical and structural characteristics of thin p + layers have been measured by FPP (four point probe), SRP (spreading resistance probe), RBS/channelling. Optimizing the implantation and annealing processes, especially using the thermal cycle of RTA followed by FA, shallow p +n junctions can be fabricated, which shows excellent I V characteristics with revers bias leakage current densities of 1.8?nA/cm 2 at -1.4?V.
Thin p + layers with good electrical properties were fabricated by RTA (rapid thermal annealing) with post FA (furance annealing) of Si + / B + dual implanted silicon wafers. The electrical and structural characteristics of thin p + layers have been measured by FPP Optimizing the implantation and annealing processes, especially using the thermal cycle of RTA followed by FA, shallow p + n junctions can be fabricated, which shows excellent IV characteristics with revers bias leakage current densities of 1.8? nA / cm 2 at -1.4? V.