【摘 要】
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The bond strength of electrodeposited nickel from common electroplate liquid and rare-earth electroplate liquid was tested and contrasted. Electrodeposited nick
【机 构】
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Department of Material and Metallurgy,Department of Life Sciences
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The bond strength of electrodeposited nickel from common electroplate liquid and rare-earth electroplate liquid was tested and contrasted. Electrodeposited nickel of high bond strength was obtained by method of electro-plate nickel with one step and special pretreatment on the surface of aluminum-alloy substrate. The bond strength between the aluminum-alloy substrate and the electrodeposited nickel was tested by the method of heat shock. Then the effect on the bond strength of the electrodeposited nickel from rare-earth compound, the thickness of the electrodeposited nickel,temperature and current density were analyzed. The experimental result shows that the bond strength between the aluminum-alloy substrate and the electrodeposited nickel is 26 MPa under the following condition( current density: 0.2 ～ 0.6 A · dm-2, thickness of the nickel electrodeposition: 8 ～ 15 μm, and temperature of the electroplate liquid: 8 ～ 25 ℃ ).
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