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建立了U形件热冲压有限元模型,探究了板料加热温度、模具间隙和保压淬火时间对热冲压制件温度场及回弹的影响,研究了残余应力与回弹的关系。结果表明,随着坯料温度的上升成形件回弹量不断减小,且在700℃左右回弹完全消失;模具间隙对回弹的影响较为复杂且无明显规律,随着保压时间的增加,回弹量先减小后几乎保持不变,最佳保压时间为5~8 min;残余应力是产生回弹的主要原因,残余应力形成的力矩越小回弹也越小。
A U-shaped hot stamping finite element model was established to study the influence of sheet heating temperature, die gap and holding pressure quenching time on the temperature field and springback of hot stamping parts. The relationship between residual stress and springback was studied. The results show that with the increase of billet temperature, the percentage of rebound of forming parts decreases and the rebound disappears completely at about 700 ℃. The influence of die gap on rebound is complicated and no obvious regularity. With the increase of dwell time, Rebound amount first decreases and remains almost unchanged, the best dwell time is 5 ~ 8 min; Residual stress is the main reason for springback, the smaller the residual stress is, the smaller the springback is.