论文部分内容阅读
90年代至21世纪初,世界电子元件将以表面安装为目标,向超小型化、超薄型化、复合化、高性能化和多功能化方向发展.电阻器在确保安全性和可靠性的同时,将继续向超小型化、片式化、高精度、高电压和标准化方向发展.电容器领域中,铝电容器在小型化同时,还将向大容量、高耐压、长寿命、高可靠性和耐波电流方向发展;钽电容器将以小型化、大容量、高可靠性为技术发展目标;陶瓷电容器技术的发展目标是开发新材料,发展现有技术,开发出具有高附加值和复合功能的产品以及开发中高压和薄型化产品.
From the 1990s to the beginning of the 21st century, the world’s electronic components will be surface-mounted, aiming at ultra-compact, ultra-thin, compound, high-performance, and multi-functional. Resistors ensure safety and reliability. At the same time, it will continue to develop in the direction of ultra-compact, chip-type, high-precision, high-voltage, and standardization. In the field of capacitors, aluminum capacitors will also be large-scale, high-voltage, long-life, and high-reliability at the same time as they are miniaturized. And the development of resistance to wave currents; tantalum capacitors will be miniaturized, large-capacity, high-reliability as the technological development goals; ceramic capacitor technology development goals are to develop new materials, develop existing technologies, and develop high value-added and composite functions. Products and development of high pressure and thin products.