论文部分内容阅读
聚酰亚胺(polyimide)是一种电绝缘特性极好的热稳定芳香族聚合物,也被用作光致抗蚀剂.现已发现经过适当剂量的离子注入之后,聚酰亚胺的电导率能提高约20个量级,达到半导体水平.作为抗电磁辐射封装材料和温敏材料,聚酰亚胺已受到广泛瞩目,被公认是一种值得重视的新型功能材料.近年来的研究已经表明:聚酰亚胺改性层电导率的提高与其内部类石墨相的形成存在密切的联系.本文通过紫外及可见光谱研究了注入过程中聚酰亚胺的结构变化,以期对其中类石墨相的形成有一个较深入的了解.
Polyimide, a thermally stable aromatic polymer with excellent electrical insulation properties, is also used as a photoresist It has now been found that after an appropriate dose of ion implantation, the conductance of the polyimide The rate can be increased by about 20 orders of magnitude to reach the semiconductor level.As the anti-electromagnetic radiation encapsulation material and temperature-sensitive material, polyimide has received wide attention, is recognized as a new functional material worthy of attention.In recent years, research has been The results show that there is a close relationship between the increase of the conductivity of the modified polyimide layer and the formation of its graphite-like phase.In this paper, the structural changes of the polyimide during the implantation process were studied by UV and visible spectroscopy, The formation of a more in-depth understanding.