论文部分内容阅读
微盲孔是一种为满足较小的线宽/间距要求而设计出来的理想的解决方法。尤其是移动通信板对线宽/间距的要求促进了微盲孔工艺的发展。同时该工艺也被应用于将元器件直接粘接在微通孔上的封装领域。对于后者,要求镀铜后微盲孔必须被完全填满。 当前,生产移动通信板的电镀设备均使用配有不溶性、有固定尺寸阳极的脉冲槽。通过这种工艺,在有效电流密度达到9A/dm~2。及微盲孔的厚径比达到1:0.75的情况下,电镀效果良好。比较起来,一般应用于封装领域的微盲孔所使用的有效电流密度要低得多,仅1A/dm~2～2A/dm~2。因该类工艺的最小线宽/间距为30μm,一般在垂直工艺设备上进行生产。 然而,当要求的封装密度增加时,通孔的
Micro blind holes are an ideal solution to meet the needs of smaller line widths / spaces. In particular, the demand for line width / spacing of mobile communication boards has promoted the development of micro-blind technology. At the same time the process has also been applied to the components directly bonded to the micro-hole in the field of packaging. For the latter, micro-blind holes must be completely filled with copper. At present, the plating equipment for the production of mobile communication boards uses a pulse tank equipped with an insoluble, fixed-size anode. Through this process, the effective current density reaches 9A / dm ~ 2. And the thickness of the micro-blind hole diameter ratio of 1: 0.75, the plating effect is good. In comparison, the effective current density commonly used in the micro-blind area of packaging is much lower, only 1 A / dm ~ 2 ~ 2 A / dm ~ 2. Due to the minimum line width / spacing of these types of processes is 30μm, usually in the vertical process equipment for production. However, when the required packing density increases, the vias