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在介绍无焊绕接技术的基础上,归纳了无焊绕接的要素及绕接过程,针对某型机载计算机无焊绕接总线板的特点,提出了总结板的测试修复方法。
On the basis of the introduction of the technology of solderless winding, the key elements of the solderless winding and the winding process are summarized. According to the characteristic of a type of airborne computer with no soldered winding, a method of testing and rebuilding the board is proposed.