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在倒装芯片应用中生长晶圆焊凸的工艺中对于间距较小(即小于150μm)、具有数个尺寸为150μm的焊凸,倒装前的焊锡涂敷好坏对产品的良率和可靠性起着重要作用。因为,如果涂敷的焊锡体积不均匀,就经不起涂敷过程中为确保涂敷在引线框上焊锡的完整和体积一致性而引入的强制视像系统检查,从而降低产出率。这就是一些组装工艺正设法减少或取消这些限制的原因。另一方面,采用直接熔化焊凸的方法来形成焊点是一种速度较快的工艺,但在保证回流处理后的离板高度方面有缺点,导致在温度和功率循环测试中的表现较差。介绍的采用铜接线柱焊凸(SolderBumponCopperStud;SBC)法解决了这些问题;对于那些需要倒装的组装工艺而言,这是可保障其制造性较佳的解决方案。介绍采用铜接线柱焊凸(SBC)工艺在附着在倒装芯片上的金属基片和焊凸之间形成焊点的新方法,利用铜接线柱焊凸技术再配合晶圆级的焊锡丝印工艺在半导体上预先形成焊凸。这是替代电镀焊凸工艺一种别具成本效益的方法。
In the process of growing the wafer bumps in flip-chip applications, for solder bumps with small pitches (ie, less than 150 μm) with several 150 μm bumps, the solder pre-flip coating yields good and bad yields on the product Sex plays an important role. This is because, if the volume of solder applied is not uniform, the forced-vision system inspection introduced to ensure complete and consistent volume of the solder applied to the lead frame during the coating process can not stand the test, thereby reducing the yield. This is why some assembly processes are trying to reduce or eliminate these limitations. On the other hand, the use of a method of directly melting the solder bumps to form solder joints is a faster process but has the disadvantage of ensuring the height of the plate after reflow, resulting in poor performance in temperature and power cycling tests . The solution to these problems is the Solder Bump Top Cooper (SBC) method, which is a solution that guarantees better manufacturability for assembly processes that require flip-chip mounting. This paper introduces a new method of forming solder joint between metal substrate and solder bumps attached by flip-chip using copper stud bump (SBC) process. By using copper stud solder bumping technology together with wafer-level solder screen printing process Pre-formed bumps on the semiconductor. This is a cost-effective alternative to plating bump processes.