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本文采用热分析方法对环氧树脂封装底填料进行了初步研究,考察了其中各组分对固化反应过程及固化产物的影响,同时也考察了球形二氧化硅(SiO2)粉末对底填料的物理性质的影响。对该环氧体系,咪唑更适于作为促进剂。在SiO2含量一定的情况下,底填料粘度随球形SiO2粒径的增加呈现先下降后上升的趋势。当球形SiO2的粒径为2.4μm时,底填料的粘度达到最小为580 mPa·s;球形SiO2粉末的加入对降低环氧树脂固化产物的热膨胀系数效果明显。
In this paper, the thermal analysis of epoxy resin underfill was carried out a preliminary study of each component of the curing reaction process and the impact of cured product, but also investigated the spherical silica (SiO2) powder underfill physical The nature of the impact. Imidazole is more suitable as an accelerator for this epoxy system. Under the condition of certain SiO 2 content, the viscosity of the underfill tends to decrease and then increase with the increase of the particle size of spherical SiO 2. When the particle size of spherical SiO2 is 2.4μm, the viscosity of the underfill reaches the minimum of 580 mPa · s. The addition of spherical SiO2 powder has obvious effect on reducing the thermal expansion coefficient of the epoxy resin cured product.