高质量6英寸4H-SiC同质外延层快速生长

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采用化学气相沉积法在6英寸(1英寸= 2.54 cm)4°偏角4H-SiC衬底上进行快速同质外延生长,通过研究Si/H2比(所用气源摩尔比)与生长速率的相互关系,使4H-SiC同质外延层生长速率达到101 μm/h.同时,系统研究了 C/Si比对4H-SiC同质外延层生长速率、表面缺陷密度和基面位错密度的影响.采用光学显微镜和表面缺陷测试仪对同质外延层缺陷形貌以及缺陷数量进行表征.结果表明,当C/Si比不小于0.75时,4H-SiC同质外延层生长速率趋于稳定,约为101μm/h,这是沉积表面硅源受限导致的.此外,随着C/Si比增加,4H-SiC同质外延层表面缺陷密度明显增多,而衬底基面位错(BPD)向刃位错(TED)转化率几乎接近100%.因此,当生长速率约为101 μm/h、C/Si比为0.77时能够获得高质量、高一致性的4H-SiC同质外延片,其外延层表面缺陷和基面位错密度分别为0.39 cm-2和0.14 cm-2,外延层厚度和掺杂浓度一致性分别为0.86%和1.80%.
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