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本篇论文以2CZ5806U型封装产品为例,着力论述一种新型的U型玻璃钝化实体封装二极管的工艺实现路径,通过对多种方案的对比验证,最终确立适合本公司的U型产品量产工艺流程,实现玻璃钝化二极管由插件式向表贴式的工艺创新,为玻璃钝化二极管谱系再添一类新结构,丰富用户的选型及应用。
This paper takes 2CZ5806U packaged products as an example, focuses on a new type of U-glass passivated solid diode packaging process to achieve the path through the comparison of a variety of programs to verify the final establishment of the company’s U-type products for mass production Process, to achieve glass passivation Diode from the plug-in to the surface-mount process innovation for glass passivation diode spectrum add a new class of structure, enrich the user’s selection and application.