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半导体工业正面临许多挑战：IC制造厂家的投资和技术开发费用的增长速度高于收入的增长，此外，IC的需求市场正在向小批量、多品种转移。常规的生产方式是建造大型芯片制造厂，生产的电路批量大而周期长。为了保持竞争能力，随机应变的工厂必须开发新一代的设计和制造技术，以便以较短的生产周期、用不同的技术生产许多种产品。斯坦福大学已制定了一个跨学科的庞大计划，其目的是探索根本不同的半导体制造途径。其方法是建造高度灵活的、由计算机控制的IC制造设施，即程控工厂，同时建造与之配套的虚拟工厂，即是用来模拟实际工厂各种功能的全套模拟设备。这二个工厂的有机结合就是制造自动化。程控工厂是新一代的IC制造方式，它以新一代的多功能设备为基础，为了增加柔性，广泛采用计算机集成制造（CIM）。这种新型的多功能设备可以迅速地一次加工一片硅片，在原位可以完成多步工艺。而传统的方法是同时加工许多硅片，但速度慢，且一台设备只做一个工艺步骤。单片加工可以采用原位监控和实时控制，工艺设备还可以模块化，具有通用的机械与电气接口。可以预计，模块化与标准化将会减少现有生产线因技术更新所必须购买设备的数量与费用。规范制订、监控、控制与信息管理中广泛采用CIM可以使各工艺之间的?
The semiconductor industry is facing many challenges: IC manufacturers’ investment and technology development costs are growing faster than revenue, and IC demand markets are shifting to smaller batches and varieties. The conventional method of production is to build a large chip manufacturing plant, the production of large quantities of circuits and long cycle. In order to remain competitive, a responsive factory must develop a new generation of design and manufacturing technologies to produce many different types of products in a shorter production cycle. Stanford has devised an interdisciplinary program that aims to explore fundamentally different approaches to semiconductor manufacturing. The approach is to build a highly flexible, computer-controlled IC manufacturing facility, a programmed plant, and an accompanying virtual plant, a full range of analogue devices that simulate the various functions of the actual plant. The organic combination of the two factories is manufacturing automation. Program-controlled plant is a new generation of IC manufacturing methods, which is based on a new generation of multi-function devices, in order to increase flexibility, widespread use of computer integrated manufacturing (CIM). This new multi-function device can quickly process a piece of silicon at a time, in place to complete the multi-step process. The traditional method is to process many silicon wafers simultaneously, but at a slow rate, with only one process step per device. Single-chip processing can be used in situ monitoring and real-time control, process equipment can also be modular, with a common mechanical and electrical interfaces. It can be expected that modularization and standardization will reduce the number and cost of existing equipment that must be purchased for technology upgrades. Widely used in CMA specification, monitoring, control and information management can make between the various processes?