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研究了CuCoCrFeNi高熵合金在镀镍和镀铜并经不同温度退火不同时间后扩散层的显微组织、成分以及扩散层厚度。结果表明,Cu原子在CuCoCrFeNi高熵合金中不易发生晶格扩散,但经高温或长时间热处理后,Cu原子可在晶界处发生扩散。Ni原子与高熵合金中的组元发生了明显的互扩散;Cu和Ni原子在高熵合金中的扩散是空位机制,只有“适配空位”才能为原子在高熵合金中提供迁移的位置。显微硬度测试结果表明,Cu/高熵合金界面处显微硬度较低,而Ni/高熵合金界面处显微硬度逐渐提高。
The microstructure, composition and diffusion layer thickness of diffusion layer of CuCoCrFeNi high-entropy alloy after nickel plating and copper plating were annealed at different temperatures were studied. The results show that Cu atoms are not easily diffused in the CuCoCrFeNi high entropy alloy. However, the Cu atoms diffuse in the grain boundary after heat treatment at high temperature or for a long time. The diffusion of Cu and Ni atoms in high-entropy alloys is a vacancy mechanism, and only the “fit gap” can provide atom migration in high-entropy alloys s position. The results of microhardness test show that the microhardness of Cu / high-entropy alloy interface is low, while the microhardness of Ni / high-entropy alloy interface is gradually increased.