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In-situ tensile testing in TEM (transmission electron microscopy) is a useful tool for studying mechanical properties of nano-structures because it can provide quanti-tative information on sample deformation at atomic scale. To facilitate in-situ TEM tensile tests of SCS (single crystal silicon) nanobeam, a MEMS tensile-testing chip was designed and fabricated. The chip was fabricated by means of bulk micro-machining and wafer bonding techniques. An SCS nanobeam, a comb drive ac-tuator, a force sensor beam and an electron beam window were integrated into the chip. With the on-chip comb-drive-actuator stretching the nanobeam and in-situ TEM observation, tensile test on a 90 nm-thick nanobeam was performed and the strain-stress relationship was obtained. The Young’s modulus was fitted to be 161 GPa and did not show the size effect.
In-situ tensile testing in TEM (transmission electron microscopy) is a useful tool for studying mechanical properties of nano-structures because it can provide quanti-tative information on sample deformation at atomic scale. To facilitate in-situ TEM tensile tests of SCS ( single crystal silicon) nanobeam, a MEMS tensile-testing chip was designed and fabricated. The chip was fabricated by means of bulk micro-machining and wafer bonding techniques. An SCS nanobeam, a comb drive ac-tuator, a force sensor beam and an electron beam window were integrated into the chip. With the on-chip comb-drive-actuator stretching the nanobeam and in-situ TEM observation, tensile test on a 90 nm-thick nanobeam was performed and the strain-stress relationship was obtained. Young’s modulus was fitted to be 161 GPa and did not show the size effect.