论文部分内容阅读
本文报导了利用四极质谱仪对红外器件真空层残气质谱分析的结果,并用它得到器件热脱刚处理工艺条件。光电导红外器件的烘烤温度可达105℃。并认为密封环境、镀银工艺的控制、消气剂设置都是重要的。随着红外应用技术的迅速发展,作为红外仪器心脏部分的探测器件,其性能的可靠性和稳定性越来越引起制造者和用户的关注。以往我们比较重视光敏元件本身的性能而对真空封装用的杜瓦瓶并不那么重视。但在实际使用中杜瓦瓶的地位并不亚于光敏元本身。在国外,许多研制生产红外探测器的厂商都将半数以上的研究技术力量投入封装和可靠性工艺。本工作的根本目的,是使工作在低温(77K)的玻璃杜瓦瓶贮LN_2的时间尽量长,即要求杜瓦瓶的真空绝热性能特别好,所以本工作归根结蒂是一个解决高真空的绝热问题。根据一般气体的脱附的弗兰克尔公式: T=T_0exp((Ed)/(RT))温度和脱附时间是反比的指数关系,因此烘烤温度无疑是影响残气脱附最重要的因素。需要指出的是:我们的红外器件目前还经不起较高温度的烘烤,这是由化合物材料自身的性能所决定的。这样,上述的问题就演变成一个“在有限烘烤温度下的高真空获得”的问题。本文,将主要运用对残气质谱分析的方法对真空封装工艺进行深入的研究,至于其它问题,后面的讨论部分作进一步的论述。
In this paper, we report the results of gas chromatography mass spectrometry in the vacuum layer of the infrared device by using a quadrupole mass spectrometer, and use it to get the thermal desorption process conditions of the device. Photoconductive infrared device baking temperature up to 105 ℃. And that the sealed environment, silver-plated process control, getter setting are important. With the rapid development of infrared application technology, the reliability and stability of its performance as a detection device in the heart of infrared instruments are attracting more and more manufacturers and users’ attention. In the past, we pay more attention to the performance of the photosensitive element itself, but not so much for the dewar bottle for vacuum packaging. However, in actual use Dewar bottle position as much as the photosensitive element itself. Abroad, many manufacturers of infrared detectors are more than half of the research and technology into packaging and reliability technology. The fundamental purpose of this work is to make LN2 work in a glass dewar for a minimum temperature (77K) for as long as possible. That is to say, the Dewar flask is required to have a particularly good vacuum insulation performance. Therefore, this work concludes with a solution to the problem of high vacuum Adiabatic problems. According to Frankel’s formula for general gas desorption: T = T_0exp ((Ed) / (RT)) The temperature is inversely proportional to the desorption time, so the baking temperature is undoubtedly the most important factor affecting the desorption of residual gas. It should be pointed out that our infrared devices can not withstand the higher temperature baking, which is determined by the performance of the compound material itself. Thus, the above problem evolved into a problem of “high vacuum at a limited baking temperature”. This article, the main use of the method of GC analysis of vacuum packaging technology in-depth study, as for other issues, discussed in the following section for further discussion.