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近几年,电子产品朝轻,薄,短,小化迅速发展,印制线路板也随着这股潮流朝向高密度封装方向发展。尤其是积层板总数的增加和导通孔以及连接盘的小径化也日益显著。对于积层线路板而言,用来加工层间连接的盲通孔(BVH)的激光方法取决于导通孔和连接盘径。激光器分为CO2激光和UV-Yag激光两种。导通孔径为60μm以上时,则一般用CO2激光加工。由于铜在CO2激光的波长(9.3μm～10.3μm)领域中的吸收比很低,因此“保形法”(在表面铜箔上,蚀刻出需要的加工孔径(开铜窗),再以激光打掉树脂)成为了现在的主流。然而,由于保形法需要蚀刻开铜窗,因此增加了形成图形的工序,而且导通孔的定位取决于下层的定位标记,容易发生错位。随着积层板层数的增加,导通孔和连接盘的小径化发展,越来越需要提高加工速度和定位精度。因此,同时对铜和树脂进行加工的“直接钻孔法”开始被关注。直接钻孔法是根据格柏数据进行导通孔的定位,因此,即使导通孔/连接盘径越趋小型化,也不会发生错位,是一种能够推进多层化,高密度化的先端技术。本文讲述了以直接钻孔法形成高可靠度导通孔时所需的技术和药品。
In recent years, electronic products toward the light, thin, short, small rapid development of printed circuit boards with the trend of this trend toward high-density packaging. In particular, the increase of the total number of laminates and the reduction of vias and lands have also become increasingly significant. For laminated circuit boards, the laser method used to process blind vias (BVHs) for interlayer connections depends on vias and land diameters. The laser is divided into CO2 laser and UV-Yag laser two. When the via diameter is 60 μm or more, CO2 laser is generally used. Since the absorption of copper in the CO2 laser wavelength range (9.3μm ~ 10.3μm) field is very low, so “conformal method” (on the surface of the copper foil, etching the required processing aperture (open copper windows), and then With resin to kill the resin) has become the mainstream now. However, since the conformal method needs to be etched to open the copper window, the process of forming the pattern is increased, and the positioning of the via hole depends on the positioning mark of the lower layer, which is prone to dislocation. With the increase in the number of laminated plies, the vias and lands of the lands are becoming smaller and smaller, and the processing speed and the positioning accuracy are more and more required. Therefore, the “direct drilling method” that simultaneously processes copper and resin begins to be noticed. The direct drilling method is a method of positioning via holes based on Gerber data. Therefore, even if the diameter of vias / land diameters is reduced, displacement does not occur. This is a technique that can promote multilayered and high density Advanced technology. This article describes the techniques and medicines required to form highly reliable vias using direct drilling.