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红外热成像技术是现代影像学中的一门新兴技术。它与x射线、B超、CT、核磁共振等显像技术的成像原理不同,它不主动发射任何射线,只是被动接受热源所发射出的红外线,经过处理后得到热源的影像。该技术的最大特点是不用接触待测物体。因此,对于一些高危行业,如核工业中元器件的检测将变得非常容易。本文所叙述的就是利用红外热像技术与显微技术的结合,制作一种红外显微镜。红外显微镜可以将出现故障的大规模集成电路板中数以万计的微小元器件的影像传输到计算机中,经过计算机的分析,可以很容易地分析出具体故障所在。因此,大范围电子元器件故障的快速检测将变得简单、快捷。
Infrared thermography is an emerging technology in modern imaging. It is different from the imaging principle of X-ray, B-, CT, MRI and other imaging technologies. It does not emit any radiation actively but only passively receives the infrared radiation emitted by the heat source and obtains the image of the heat source after processing. The most important feature of this technology is that it does not touch the object to be measured. Therefore, for some high-risk industries, such as the detection of components in the nuclear industry will become very easy. Described in this article is the use of infrared thermography and microscopy combined to produce an infrared microscope. Infrared microscopes can transfer the images of tens of thousands of tiny components in a failed large-scale integrated circuit board to a computer, and after computer analysis, it is easy to analyze the specific fault. Therefore, the rapid detection of a wide range of electronic components failure will become simple and fast.