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我国作为全球制造大国,IT业的蓬勃发展推动着电子封装测试业和材料业的日益繁荣。随着电子产品在不断追逐轻、薄、短、小,集成电路在向高集成化、布线细微化、芯片大型化、薄型化方向推进,迫使电子封装形式进一步演化为以CSP、MCM、SIP、COB等为代表的高密度封装,电子封装材料的性能则不断地向高导热、高耐热、高流动和低应力方向发展。环氧塑封料(简称塑封料,Epoxy Molding Compound,EMC)作为封装电子器件和集成电路最主要的一种热固性高分子复合材料,出现于20世纪60年代,其体系不断更新,尤其是历经近30年来的多次改性和技术突破,已越来越成熟。我国最早由中科院化学所与北京科化公司开发形成的邻甲酚环氧树脂型环氧塑封料主要是以环氧树脂、酚醛树脂为主体材料,加入石英粉填料和多种添加剂,通过加热挤出、混炼、成形而得到环氧塑封料。在使用中通过高温低压传递来封装分立器件、集成电路。其中,树脂的结构与性能直接影响EMC固化后的致密性、耐热性,石英粉填料的用量、颗粒分布和颗粒形状直接影响EMC的导热系数、膨胀系数等。目前,国际上塑封料已经形成完整的系列产品。这里就环氧塑封料的产业现状,特别是我国塑封料的市场、技术情况以及存在的问题进行阐述。
As a big manufacturing country in the world, China’s booming IT industry drives the electronic packaging and testing industry and the material industry to become increasingly prosperous. As electronic products continue to chase light, thin, short, small, integrated circuits in the higher integration, wiring miniaturization, large-scale chips, the direction of thinner, forcing the electronic packaging form further evolved to CSP, MCM, SIP, COB and other high-density packaging represented by the performance of electronic packaging materials are constantly to high thermal conductivity, high heat resistance, high flow and low stress direction. Epoxy Molding Compound (EMC), the most important thermosetting polymer composite material for packaging electronic devices and integrated circuits, appeared in the 1960s and its system is continuously updated. In particular, after nearly 30 Several years of modification and technological breakthroughs have become more and more mature. China’s first by the CAS Institute of Chemistry and Beijing Branch of the company developed the formation of o-cresol epoxy resin epoxy resin is mainly based on epoxy resin, phenolic resin as the main material, adding quartz powder filler and a variety of additives, squeezed by heating Out, mixing, forming and get epoxy plastic material. In use through the transmission of high temperature and low voltage to discrete components, integrated circuits. Among them, the structure and properties of the resin have a direct impact on the EMC density, heat resistance, the amount of quartz filler, particle distribution and particle shape directly affect the EMC thermal conductivity, expansion coefficient. At present, the international plastic molding material has formed a complete series of products. Here on the current situation of epoxy plastic sealing material industry, especially the plastic material market in China, the technical situation and the existing problems are described.