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在组成泥浆的粘土、水、处理剂中，氢键作用的现象非常普遍。这种特殊的作用力对粘土、处理剂（特别是高分子处理剂）、泥浆等性能的变化起着很大的影响。那么，什么是氢键？氢键有那几种类型？它对泥浆性能起什么作用？氢键作用力的大小又有那些规律？这些问题都是我们钻探工作者极感兴趣的问题，了解这些现象和变化规律，对我们正确判断泥浆中的各种问题以及能动地控制这些性能具有指导意义。所谓氢键就是带正电荷的氢核能同时和两个电负性很大，而原子半径较小的原子（如氟、氧、氢等）相结合，这种结合就叫氢键，其通式是：X—H…Y。
The phenomenon of hydrogen bonding is very common among the clay, water, and treating agents that make up the mud. This special force on clay, processing agents (especially polymer processing agent), mud and other properties of a great impact. So, what is a hydrogen bond? What are the types of hydrogen bonding? What does it do to mud performance? The size of the hydrogen bond forces have those laws? These questions are extremely interesting to our drillers. Understanding these phenomena and their changing patterns is instructive in correctly judging various problems in mud and in controlling these performances. The so-called hydrogen bond is a positively charged hydrogen nucleus at the same time and two electronegativity is very large, and the atomic radius of the smaller atoms (such as fluorine, oxygen, hydrogen, etc.) combined, this combination is called hydrogen bonds, the general formula Is: X-H ... Y.