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一、前言 光致抗蚀剂又名光刻胶。它是将感光性树脂溶解于适当的溶剂中再加入添加剂(如增感剂),经光照射后发生交联,分解或聚合等光化学反应的高分子溶液。近十几年来,它已广泛地应用于金属凸版,印刷线路版,彩色显像管制造,集成电路和其它电子元件的加工制造等方面。近年来,国内外对光刻技术研究的重点是提高分辨率和精度,其主要措施是改进光致抗蚀剂质量,科学地使用光致抗蚀剂和提高制版设备的精度。 为了适应电子工业继续向超高频、超高速、大面积和高集成度方面急速发展,光致抗蚀剂必须和电子工业有关方面的条件密切配合,这就要求光致抗蚀剂必须具备下列条件: 1.对衬底(Si,SiO_2,Al,W,Cr等)有良好粘附性。 2.涂成的胶膜要有良好的抗蚀性,致密,无针孔。 3.分辨率高,线条的清晰度好,尺寸精度高。 4.光灵敏度高且稳定。 5.质量稳定、干净,没有杂质,显影后无残渣。 6.使用方便。 但是,迄今为止还没有一种光致抗蚀剂能完全满足上述要求,例如:对衬底表面粘附性问题,有些光致抗蚀剂对各种衬底都能粘附,但粘附性差,而另一些光致抗蚀剂对
First, the preface Photoresist also known as photoresist. It is the photosensitive resin dissolved in an appropriate solvent and then add additives (such as sensitizers), after light irradiation occurred crosslinking, decomposition or polymerization of photochemical reaction of the polymer solution. In recent ten years, it has been widely used in metal letterpress, printed circuit board, color picture tube manufacturing, integrated circuits and other electronic components manufacturing and so on. In recent years, the focus of lithography research at home and abroad is to improve the resolution and accuracy. The main measures are to improve the quality of photoresist, use photoresist in a scientific way and improve the precision of plate making equipment. In order to meet the electronics industry continues to rapid development of ultra-high frequency, high speed, large area and high integration, photoresist and the electronics industry must be closely related conditions, which requires the photoresist must have the following Conditions: 1. The substrate (Si, SiO_2, Al, W, Cr, etc.) have good adhesion. 2. Painted film to have good corrosion resistance, dense, no pinhole. 3. High resolution, good line resolution, high dimensional accuracy. 4 light sensitivity and stability. 5. Stable quality, clean, no impurities, no residue after development. 6. Easy to use. However, no photoresist has hitherto been able to fully satisfy the above requirements. For example, there are problems with adhesion to the surface of the substrate. Some photoresists adhere to a variety of substrates, but the adhesion is poor , While others are pairs of photoresists