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本文介绍了研究开发全焊接结构的硅压力敏感元件的具体内容及解决的技术关键问题。对硅-玻璃-金属静电封接工艺做了一些论述。最后给出了研制的全焊接结构的扩散硅压力敏感元件的性能指标、测试结果。
This article describes the research and development of all-welded structure of the silicon pressure sensitive components of the specific content and solve the key technical issues. The silicon - glass - metal electrostatic sealing process made some discussion. Finally, the performance index and test results of diffused silicon pressure sensor with all-welded structure are given.