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叙述了新一代CMP浆料的过滤工艺和方法。低比重和极小平均粒子尺寸的二氧化硅、氧化铝及氧化铈磨料在这些浆料中要求严格地控制在0.5μm,甚至对平均工作粒影响最小的更小粒子(例如0.03～0.2μm)以内。目前CMP浆料大量生产的加工目标将积累的大于0.56及1.01μm的大颗粒减少了90%,在一次通过或现场使要求如此高的隔离过滤。根据浆料的特性能够采用的过滤方法如分级筛选密度、多薄层法、深褶媒质以及薄膜过滤法。CMP浆料过滤器的有效设计必须考虑到浆料磨损类型和成分、基本化学特性、LPCS、平均粒子尺寸分布、固体比重、粘性、磨料沉积速率、所需的粒子滞留、△P、流速稳定性和期望的过滤器寿命。由于磨料中相同的过滤器媒质性能根据浆料中磨料和添加剂的不同可能有很大的差别,新浆料过滤的最佳参数选顶实质上仍然保持了以实验为根据的方法。根据实验室表示特性、现场性能测试和过滤后的使用评价的数据,可以用作过滤最佳参数选定。由这些测试的典型结果现实,更新的氧化铈和氧化铝以及固有的二氧化硅CMP浆料的过滤有利于大颗粒的控制。
Describes a new generation of CMP slurry filtration process and method. Silica, alumina and cerium oxide abrasives with low specific gravity and a very small average particle size are required in these pastes to be controlled strictly at 0.5 μm and even with smaller particles (eg 0.03-0.2 μm) which have the least effect on the average work- Within. The current CMP slurry processing goal is to reduce the accumulated large particles larger than 0.56 and 1.01 μm by 90% and to require such high isolation and filtration in one pass or on site. Filtering methods that can be used depending on the characteristics of the slurry, such as graded screening density, multi-lamella method, deep pleated media, and membrane filtration. The effective design of a CMP slurry filter must take into account the type and composition of slurry wear, basic chemistry, LPCS, average particle size distribution, solids specific gravity, viscosity, abrasive deposition rate, desired particle retention, ΔΡ, flow stability And the desired filter life. Since the same filter media properties in the abrasive can vary widely depending on the abrasive and additives in the slurry, the optimal parameters for the new slurry filtration essentially remain experimentally based. Data based on laboratory characterization, on-site performance testing, and post-filtration usage evaluation can be selected as the optimal filter parameters. As a result of the typical results of these tests, the filtration of the newer ceria and alumina as well as the inherent silica CMP slurry facilitates the control of large particles.