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日本欧姆龙公司将和美国球面半导体公司联合开发采用球面半导体技术的小型感应器，其尺寸和成本可望降到现有产品的 １／１０。 球面半导体是在直径约１毫米的球状硅表面上安装集成电路，和现有的半导体相比，可装上３倍的集成电路，是新一代的半导体之一种、新型感应器将用球?
Japan’s Omron Corporation and American Spherical Semiconductor companies will jointly develop spherical sensors using small semiconductor technology, the size and cost is expected to be reduced to 1/10 of the existing products. Spherical semiconductors are integrated circuits on a spherical silicon surface with a diameter of about 1 mm. Compared with the existing semiconductors, the semiconductors can hold 3 times the integrated circuit. This is a new generation of semiconductors. Will the new sensor use the ball?