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描述了一种基于斜率传感器的大型硅晶片平面度扫描测量系统.采用二维斜率传感器对晶片表面扫描,以获得表面绕X和Y轴的倾斜度.斜率传感器装在X向滑板上,而晶片固定在可绕Z轴转动的主轴上.对斜率传感器Y向的输出积分,得到晶片表面各个同心圆上轮廓截面高度.对斜率传感器X向的输出积分,得到晶片表面沿X向的截面轮廓,从而获得各同心圆轮廓之间的关系.构建了一个包括基于自准直原理的小型斜率传感器、气浮主轴、气浮导轨的实验系统,提出一种斜率传感器现场标定方法.用此系统测量了直径300 mm的硅晶片平面度.
A large-scale silicon wafer flatness scanning measurement system based on a slope sensor is described. The surface of the wafer is scanned using a two-dimensional slope sensor to obtain the inclination of the surface around the X and Y axes. The slope sensor is mounted on the X-direction slider, Fixed on a spindle rotatable about the Z axis, integrating the output of the slope sensor Y to obtain the contour cross-section height of each concentric circle on the wafer surface, integrating the output of the slope sensor X direction to obtain the cross-sectional profile along the X direction of the wafer surface, So as to obtain the relationship between concentric circles.An experimental system including a small slope sensor based on self-collimation principle, an airfoil main shaft and an air-floating guideway was constructed, and a method for on-site calibration of the slope sensor was proposed.This system measured Silicon wafer flatness of 300 mm in diameter.