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单片机和模拟半导体供应商--MicrochipTechnology(美国微芯科技公司)近日宣布,该公司所有的产品自2005年1月起将采用符合环保要求的无铅焊镀封装,以符合即将在全球范围内实施的政府法规和行业标准。Microchip将采用雾锡(Matte tin)作为新的焊镀材料,确保所有的无铅产品都能向后兼容于行业标准和锡／铅焊接工艺,并向前兼容用于采用锡／银／铜等专业无铅锡膏的高温无铅工艺。 欧盟将从2006年7月1月起实施“有害物质限制(RoHS)”法令,对所有在欧盟成员国内生产和销
Microcontroller and analog semiconductor supplier - Microchip Technology (Microchip Technology Inc.) recently announced that all of its products since January 2005 will be environmentally friendly lead-free solder plating package to meet the upcoming global implementation Government regulations and industry standards. Microchip will use Matte tin as a new solder plating material to ensure that all lead-free products are backward compatible with industry standards and tin / lead soldering processes and are forward compatible for tin / silver / copper, etc. Lead-free solder paste professional high-temperature lead-free process. The European Union will implement the “Restriction of Hazardous Substances (RoHS)” Act from July 2006 onwards, to all EU member states producing and marketing