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现代IT产业的发展催生了蓝牙技术的发展。而蓝牙技术的发展迫切需要发展高性能三维功能衬底技术。AlN陶瓷具有优良的综合性能。研究了AlN流延坯和Ag导体浆料的低温共烧技术 ,比较了在AlN成瓷基板上的各种金属化工艺。
The development of modern IT industry has spawned the development of Bluetooth technology. The development of Bluetooth technology urgently needs to develop high-performance 3D functional substrate technology. AlN ceramic has excellent overall performance. The low temperature co-firing of AlN blank and Ag conductor pastes was studied and various metallization processes on AlN substrates were compared.