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目的 :观察牙周牙髓联合病变应用半导体激光辅助治疗的效果。方法 :选择2013年11月~2015年11月医院收治的牙周牙髓联合病变患者118例,随机分为两组,研究组59例,在常规治疗基础上给予半导体激光辅助治疗,对照组59例,给予常规治疗,观察两组患者治疗前、治疗后3个月、治疗后6个月的相关指标情况。结果:治疗前,两组患者相关指标差异无统计学意义(P>0.05);研究组治疗后3个月及6个月各项指标均低于对照组,差异具有统计学意义(P<0.05)。结论 :牙周牙髓联合病变治疗中,应用半导体激光辅助治疗后可提升治疗效果,促进患者痊愈。
OBJECTIVE: To observe the effect of semiconductor laser-assisted treatment of periodontal-pulp combined lesions. Methods: A total of 118 patients with periodontal and endodontic joint diseases admitted from November 2013 to November 2015 in our hospital were randomly divided into two groups. The study group consisted of 59 patients receiving laser diode assisted laser irradiation and the control group Cases, given conventional treatment, observed two groups of patients before treatment, after treatment for 3 months, 6 months after treatment related indicators. Results: Before treatment, there was no significant difference between the two groups (P> 0.05). The indexes in study group were lower than those in control group at 3 months and 6 months after treatment (P <0.05) ). Conclusion: In the treatment of periodontal-endodontic joint diseases, the application of semiconductor laser-assisted therapy can improve the therapeutic effect and promote the recovery of patients.