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2003年9月23日南京高新半导体公司在江北高新技术产业开发区动工建设,总投资达3.6亿美元,是第一个投资南京的半导体芯片项目,预计2005年建成投产后,产品将有一半供应国外市场。据了解,该项目注册资本为1.2亿美元,规划面积0.7平方公里,将建成两条晶圆生产流水线,年产72万片的销售收入可达3亿美元以上。该公司将采用高压制造工艺生产0.35微米集成电路芯片,主要用于液晶显示驱动器、功率集成电路及微控制器,该项目将填补南京半导体行业的空白。
September 23, 2003 Nanjing Hi-tech semiconductor company in Jiangbei High-tech Industrial Development Zone to start construction, with a total investment of 360 million US dollars, is the first investment in Nanjing’s semiconductor chip project is expected to put into operation in 2005 after half of the product will be half of the supply foreign market. It is understood that the project registered capital of 120 million US dollars, the planned area of 0.7 square kilometers, will be completed two wafer production lines, with an annual output of 720,000 pieces of sales up to 300 million US dollars. The company will use high-voltage manufacturing process to produce 0.35-micron integrated circuit chips, mainly for liquid crystal display drivers, power integrated circuits and microcontrollers, the project will fill the gaps in Nanjing’s semiconductor industry.