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本文报道了多靶直流磁控共溅射系统的设计及性能，三个直流磁控溅射枪呈１２０°空间角分布于真空罩上，并聚焦于基板中心，靶的有效直径为φ５０ｍｍ，靶平面的法线与基板的法线成６０°夹角，基板可绕中心轴旋转。该系统中生长出φ７０ｍｍ范围内膜厚均匀的大面积薄膜，特别适合于制备大面积、多组元金属氧化物薄膜及合金薄膜。
In this paper, the design and performance of a multi-target DC magnetron sputtering system are reported. Three DC magnetron sputtering guns are distributed on the vacuum mask at a spatial angle of 120 ° and focus on the center of the substrate. The effective diameter of the target is φ50mm. Plane normal and substrate normal angle of 60 °, the substrate can rotate around the central axis. In the system, a large area film with the thickness of φ70mm is grown, which is especially suitable for preparing large area and multi-component metal oxide films and alloy films.